Klaus Ilgenfritz serves as Senior Vice President and Chief Product Officer at Cohu Inc., a leading provider of semiconductor test and inspection equipment. In this role, he leads the company's global product strategy, portfolio management, and innovation roadmap, driving advancements in test interfaces, handlers, and metrology solutions to meet the evolving demands of the semiconductor industry. With over 25 years of experience in the sector, Ilgenfritz brings deep expertise in advanced packaging, wafer-level testing, and process optimization, ensuring Cohu's offerings remain at the forefront of high-volume manufacturing for AI, automotive, and consumer electronics applications. Prior to joining Cohu in 2021, Ilgenfritz held senior leadership positions at industry pioneers such as Besi (formerly ASM Pacific Technology), where he was Vice President of Product Management for Advanced Packaging, spearheading the development of die attach and encapsulation systems that captured significant market share. His earlier career included roles at EV Group as Director of Product Marketing for wafer bonders and lithography tools, and at KLA-Tencor, where he contributed to defect inspection and metrology product lines. These experiences honed his ability to align R&D with customer needs, resulting in multiple successful product launches and revenue growth exceeding 20% annually in his teams. Under Ilgenfritz's guidance, Cohu has accelerated its product innovation, including the integration of AI-driven analytics into its test solutions and expansion into heterogeneous integration technologies. His strategic vision has positioned the company to capitalize on megatrends like chiplet architectures and 3D stacking, earning recognition for Cohu's enhanced competitiveness and customer satisfaction metrics. Ilgenfritz holds a degree in Microelectronics from the University of Applied Sciences in Wiener Neustadt, Austria, and remains a vocal advocate for sustainable semiconductor manufacturing practices.