Chuck Xu serves as President of Interconnect Solutions at QNITY ELECTRONICS INC., where he oversees the strategic direction, product development, and global operations for the division specializing in high-performance interconnects, including cables, connectors, and backplanes for data centers, telecommunications, and automotive applications. With more than 25 years of experience in the electronics industry, Chuck began his career as a design engineer at Taiwan Semiconductor Manufacturing Company (TSMC), focusing on signal integrity and high-speed PCB layouts. He later advanced through progressively senior roles at Molex and TE Connectivity, honing his expertise in RF/microwave interconnects and optical solutions. Under Chuck's leadership, his teams have achieved remarkable milestones, including the commercialization of 400G/800G Ethernet interconnect platforms that power hyperscale cloud infrastructure for clients like Google and Amazon. He holds over 15 U.S. patents in low-loss materials and impedance-controlled designs, and his contributions earned him the IPC Raymond E. Pritchard Hall of Fame Award for excellence in interconnect technology. Prior to QNITY, as VP of Advanced Interconnects at Amphenol, he spearheaded a turnaround that tripled division revenue and expanded market penetration into 5G and EV sectors. At QNITY ELECTRONICS INC., Chuck drives innovation to address emerging demands in AI accelerators and edge computing, fostering cross-functional teams that deliver customizable, high-reliability solutions with reduced latency and power consumption. His vision emphasizes sustainable manufacturing and supply chain resilience, positioning the Interconnect Solutions division for sustained growth amid rapid technological evolution.